Capabilities Overview
Rapid Electronics Innovation with BESTProto
Welcome to BESTPRoto
Your Product Development Partner
BESTProto is a leading U.S. Electronics Contract Manufacturer specializing in quick-turn prototyping and assembly services. Our capabilities range from CCA and PCBA prototypes to higher-level complex electromechanical box builds, ensuring a seamless path from concept to production.
Serving product development communities throughout the nation since 2005, we have a credible track record of delivering precision, speed, service excellence, and unbeatable value in high-mix, low-volume (HMLV) manufacturing, helping innovators bring products to life, faster and smarter.
Why BESTPRoto
We work directly with product design engineering and NPI teams, with the electronic product makers in need of quick-turn prototypes and high-mix, low-volume production runs.
We understand speed and quality, and we’ve built our reputation on both. We’re master-certified in IPC A610/A620 and J-STD-001 standards to build your prototypes right the first time.
Quick-Turn Assembly
Flexible Turn-Times
Consigned Material or Full Turnkey
No Minimum Build Quantities
DFM Feedback
Board Modifications
Process Development
QT9 Quality Management
Compliance & Certifications
We pride ourselves on providing services that meet or exceed government-established regulations and requirements related to national security, cybersecurity, product quality, supply chain transparency, and fair pricing. This positions us as reliable partners in mission-critical defense, aerospace, medical, and industrial projects.
AS9100-2016
ISO9001-2015
ITAR
NIST 800-171
SAM / CAGE / DUNS
IPC COMPLIANCE
General Capabilities
SMT Assembly, from small odd-shaped
boards to backplane size
Rigid, Flex, Rigid-Flex board assembly
Stencil-less solder printing capability
Box Builds
Wire and Cable Harness Assembly
Process Development
In-house Conformal Coating
Surface Mount Technology
Component values tested prior to placement
01005 components and 0.4 mm BGAs placement
PoP (Package-on-Package) Assembly
Cut-tape, trays, or tubes can be utilized
BGA, QFN, LGA and other leadless packages a specialty
Advanced multi-zone reflow soldering
100% X-ray and endoscopic inspection of leadless devices
Automated Optical Inspection (AOI)
Thru-Hole Technology
Press Fit Connectors and Terminals:
• Tooling design and presses for press-fit connectors
• Power and Antenna connectors
Pin-in-Paste Soldering
• Ideal for mixed-technology boards, this method is used to place through-hole parts such as connectors, headers, switches, etc. on a PCB using a reflow process.
Manual Placement:
• Radial and axial, electrolytic caps, connectors, brackets, guides, etc.
• High-density components
Board Cleaning:
• Aqueos closed-loop cleaner
• Built-in omega meter allows for pre-set cleanliness levels
Wave Soldering:
• Tin/lead, lead-free (RoHS) available
Board Modification & Rework
Board Modifications:
• We can make physical changes to a board to allow powering up and testing to cut down on board spins
• Trace Modifications
• Adding new components
• BGA and High Density chip replacements
Rework and Repair:
• Performed per IPC 7711 and IPC 7721 standards by IPC trained and
certified technicians
• Extensive collection of rework and repair equipment in-house
Inspection & Testing
Inspection Verification:
• Trained Inspectors certified and trained
to IPC A610, A620, JSTD, IPC 7711, and IPC
7721 standards
• AOI (Automated Optical Inspection) with
OCR, inspects for part presence,
polarity, orientation, markings,
tombstone, and billboard issues, as well
as solder joint quality
• X-ray and endoscopic inspections
of leadless devices, e.g. BGA, QFN,
LGA, etc.
Testing & Programming:
• Flash programming
• Flying probe testing
• Functional testing
• Standard test equipment
in-house or develop custom
test fixtures and procedures
• Component level
troubleshooting
Rapid Electronics Innovation with BESTProto